{"id":82481,"date":"2025-11-11T11:31:37","date_gmt":"2025-11-11T14:31:37","guid":{"rendered":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82481"},"modified":"2025-11-11T12:01:20","modified_gmt":"2025-11-11T15:01:20","slug":"docente-investigador-de-la-fiuna-presento-trabajos-en-la-conferencia-internacional-ieee-chilecon-2025","status":"publish","type":"post","link":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82481","title":{"rendered":"Docente investigador de la FIUNA present\u00f3 trabajos en la conferencia internacional IEEE CHILECON 2025"},"content":{"rendered":"<p>El docente investigador <strong>MSc. Ing. Marcos Alberto G\u00f3mez Redondo,<\/strong> de la <strong>Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA)<\/strong>, adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 activamente en la <strong>conferencia internacional IEEE Chilecon 2025<\/strong>, celebrada en Valpara\u00edso, Chile. Este evento se posiciona como uno de los m\u00e1s relevantes de la regi\u00f3n en los campos de la ingenier\u00eda el\u00e9ctrica, electr\u00f3nica y computaci\u00f3n.<!--more--><\/p>\n<p>La conferencia se llev\u00f3 a cabo en conjunto con el JCC y el CLEI, dos importantes encuentros sobre ciencias computacionales e inform\u00e1tica desarrollados en Chile. En esta edici\u00f3n interdisciplinaria, se reunieron destacados profesionales, acad\u00e9micos y estudiantes de diversas partes del mundo, fomentando el intercambio de experiencias, la presentaci\u00f3n de avances tecnol\u00f3gicos y la creaci\u00f3n de redes de colaboraci\u00f3n cient\u00edfica.<\/p>\n<p>Durante su participaci\u00f3n, el Ing. G\u00f3mez Redondo present\u00f3 un total de seis art\u00edculos cient\u00edficos. Tres de ellos fueron de su autor\u00eda, desarrollados en colaboraci\u00f3n con investigadores de la FIUNA, la Universidad de Nottingham, la Universidad de Talca y la Universidad de Mato Grosso. Adem\u00e1s, present\u00f3 otros tres art\u00edculos en representaci\u00f3n de colegas internacionales que no pudieron asistir al evento.<\/p>\n<p>Esta participaci\u00f3n refuerza el compromiso de la FIUNA con la investigaci\u00f3n cient\u00edfica, la cooperaci\u00f3n internacional y la difusi\u00f3n del conocimiento en \u00e1reas clave de la ingenier\u00eda.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>El docente investigador MSc. Ing. Marcos Alberto G\u00f3mez Redondo, de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA), adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 activamente en la conferencia internacional IEEE Chilecon 2025, celebrada en Valpara\u00edso, Chile. Este evento se posiciona como uno de los m\u00e1s relevantes de la regi\u00f3n en los campos de la ingenier\u00eda el\u00e9ctrica, electr\u00f3nica y computaci\u00f3n.<\/p>\n","protected":false},"author":1,"featured_media":82516,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_bbp_topic_count":0,"_bbp_reply_count":0,"_bbp_total_topic_count":0,"_bbp_total_reply_count":0,"_bbp_voice_count":0,"_bbp_anonymous_reply_count":0,"_bbp_topic_count_hidden":0,"_bbp_reply_count_hidden":0,"_bbp_forum_subforum_count":0,"advanced_seo_description":"","jetpack_seo_html_title":"","jetpack_seo_noindex":false,"jetpack_post_was_ever_published":false,"_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2}},"categories":[90,824,887,226,75,349],"tags":[932,172],"class_list":["post-82481","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-conferencia-magistral","category-departamento-de-ingenieria-electronica-y-mecatronica","category-eventos","category-investigaciones","category-noticias","category-publicacion-de-investigacion","tag-chilecon","tag-ieee"],"jetpack_publicize_connections":[],"jetpack_featured_media_url":"https:\/\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/chilecon2025_recortado_redondo.jpg","jetpack_shortlink":"https:\/\/wp.me\/pc8Odv-lsl","jetpack_likes_enabled":true,"jetpack_sharing_enabled":true,"jetpack-related-posts":[],"_links":{"self":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82481","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=82481"}],"version-history":[{"count":3,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82481\/revisions"}],"predecessor-version":[{"id":82523,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82481\/revisions\/82523"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/media\/82516"}],"wp:attachment":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=82481"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=82481"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=82481"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}