{"id":82481,"date":"2025-11-11T11:31:37","date_gmt":"2025-11-11T14:31:37","guid":{"rendered":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82481"},"modified":"2025-11-11T12:01:20","modified_gmt":"2025-11-11T15:01:20","slug":"docente-investigador-de-la-fiuna-presento-trabajos-en-la-conferencia-internacional-ieee-chilecon-2025","status":"publish","type":"post","link":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82481","title":{"rendered":"Docente investigador de la FIUNA present\u00f3 trabajos en la conferencia internacional IEEE CHILECON 2025"},"content":{"rendered":"<p>El docente investigador <strong>MSc. Ing. Marcos Alberto G\u00f3mez Redondo,<\/strong> de la <strong>Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA)<\/strong>, adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 activamente en la <strong>conferencia internacional IEEE Chilecon 2025<\/strong>, celebrada en Valpara\u00edso, Chile. Este evento se posiciona como uno de los m\u00e1s relevantes de la regi\u00f3n en los campos de la ingenier\u00eda el\u00e9ctrica, electr\u00f3nica y computaci\u00f3n.<!--more--><\/p>\n<p>La conferencia se llev\u00f3 a cabo en conjunto con el JCC y el CLEI, dos importantes encuentros sobre ciencias computacionales e inform\u00e1tica desarrollados en Chile. En esta edici\u00f3n interdisciplinaria, se reunieron destacados profesionales, acad\u00e9micos y estudiantes de diversas partes del mundo, fomentando el intercambio de experiencias, la presentaci\u00f3n de avances tecnol\u00f3gicos y la creaci\u00f3n de redes de colaboraci\u00f3n cient\u00edfica.<\/p>\n<p>Durante su participaci\u00f3n, el Ing. G\u00f3mez Redondo present\u00f3 un total de seis art\u00edculos cient\u00edficos. Tres de ellos fueron de su autor\u00eda, desarrollados en colaboraci\u00f3n con investigadores de la FIUNA, la Universidad de Nottingham, la Universidad de Talca y la Universidad de Mato Grosso. Adem\u00e1s, present\u00f3 otros tres art\u00edculos en representaci\u00f3n de colegas internacionales que no pudieron asistir al evento.<\/p>\n<p>Esta participaci\u00f3n refuerza el compromiso de la FIUNA con la investigaci\u00f3n cient\u00edfica, la cooperaci\u00f3n internacional y la difusi\u00f3n del conocimiento en \u00e1reas clave de la ingenier\u00eda.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>El docente investigador MSc. Ing. Marcos Alberto G\u00f3mez Redondo, de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA), adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 activamente en la conferencia internacional IEEE Chilecon 2025, celebrada en Valpara\u00edso, Chile. Este evento se posiciona como uno de los m\u00e1s relevantes de la regi\u00f3n en los campos de la ingenier\u00eda el\u00e9ctrica, electr\u00f3nica y computaci\u00f3n.<\/p>\n","protected":false},"author":1,"featured_media":82516,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"advanced_seo_description":"","jetpack_seo_html_title":"","jetpack_seo_noindex":false,"jetpack_seo_schema_type":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"page_builder":"","_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2},"jetpack_post_was_ever_published":false},"categories":[90,824,887,226,75,349],"tags":[932,172],"class_list":["post-82481","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-conferencia-magistral","category-departamento-de-ingenieria-electronica-y-mecatronica","category-eventos","category-investigaciones","category-noticias","category-publicacion-de-investigacion","tag-chilecon","tag-ieee"],"jetpack_publicize_connections":[],"jetpack_shortlink":"https:\/\/wp.me\/pc8Odv-lsl","jetpack_likes_enabled":true,"jetpack_sharing_enabled":true,"jetpack-related-posts":[{"id":82518,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82518","url_meta":{"origin":82481,"position":0},"title":"Doctorando de la FIUNA particip\u00f3 en el IEEE CHILECON 2025","author":"Admin","date":"11\/11\/2025","format":false,"excerpt":"El MSc. Ing. Oscar Paredes Bustto, estudiante del Programa Doctoral en Electr\u00f3nica de Potencia de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) y adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 en el IEEE Chilecon 2025, realizado en Valpara\u00edso, Chile, uno de los eventos\u2026","rel":"","context":"En \u00abConferencia\u00bb","block_context":{"text":"Conferencia","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=90"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Oscar-Paredes.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Oscar-Paredes.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Oscar-Paredes.jpg?resize=525%2C300&ssl=1 1.5x"},"classes":[]},{"id":59397,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=59397","url_meta":{"origin":82481,"position":1},"title":"Investigadores y estudiantes de la FIUNA presentaron trabajos en el Conferencia IEEE CHILECON 2023","author":"Admin","date":"13\/12\/2023","format":false,"excerpt":"Investigadores y estudiantes de la carrera Ingenier\u00eda Mecatr\u00f3nica de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) presentaron sus trabajos de investigaci\u00f3n en la Conferencia IEEE CHILECON 2023, realizado del 5 al 7 de diciembre del 2023 en la ciudad de Valdivia, Regi\u00f3n de los R\u00edos, Chile.\u00a0\u2026","rel":"","context":"En \u00abCongreso\u00bb","block_context":{"text":"Congreso","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=92"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=700%2C400&ssl=1 2x"},"classes":[]},{"id":82222,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82222","url_meta":{"origin":82481,"position":2},"title":"La FIUNA participa en CHILECON 2025 con 25 art\u00edculos de investigaci\u00f3n","author":"Admin","date":"30\/10\/2025","format":false,"excerpt":"La Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) participa en el CHILECON 2025, una de las conferencias m\u00e1s importantes de la IEEE Chilean Chapter on Electronics, Electrical and Computer Engineering, que se celebra del 28 al 30 de octubre de 2025 en Valpara\u00edso, Chile, bajo la organizaci\u00f3n\u2026","rel":"","context":"En \u00abEventos\u00bb","block_context":{"text":"Eventos","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=887"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/10\/chilecon2025.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/10\/chilecon2025.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/10\/chilecon2025.jpg?resize=525%2C300&ssl=1 1.5x"},"classes":[]},{"id":15691,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=15691","url_meta":{"origin":82481,"position":3},"title":"Destacada participaci\u00f3n de la FIUNA en Congreso Internacional de Ingenier\u00eda","author":"Admin","date":"04\/11\/2015","format":false,"excerpt":"\u00a0Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA)\u00a0tuvo una destacada participaci\u00f3n en el\u00a0Congreso Internacional de IEEE CHILECON 2015, con la exposici\u00f3n del Ing. Msc. Mario Arzamendia, quien present\u00f3 \u00a0de un trabajo realizado por investigadores del\u00a0Laboratorio de Sistemas Distribuidos (LSD). Tambi\u00e9n particip\u00f3 del evento Jefe del Departamento de Electricidad\u2026","rel":"","context":"En \u00abCongreso\u00bb","block_context":{"text":"Congreso","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=92"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2015\/11\/Confreso-IEEEChile.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2015\/11\/Confreso-IEEEChile.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2015\/11\/Confreso-IEEEChile.jpg?resize=525%2C300&ssl=1 1.5x"},"classes":[]},{"id":82490,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82490","url_meta":{"origin":82481,"position":4},"title":"Tecnolog\u00eda paraguaya en \u00f3rbita: participaci\u00f3n de la FIUNA en la misi\u00f3n GuaraniSat-2","author":"Admin","date":"10\/11\/2025","format":false,"excerpt":"Investigadores de la FIUNA desarrollaron un sistema de detecci\u00f3n de part\u00edculas energ\u00e9ticas a bordo del nanosat\u00e9lite GuaraniSat-2.\u00a0 En el IEEE Chilean Conference on Electrical, Electronic Engineering, Informatics and Communications Technology (CHILECON 2025), realizado en Valpara\u00edso, Chile, investigadores de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) presentaron\u2026","rel":"","context":"En \u00abConferencia\u00bb","block_context":{"text":"Conferencia","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=90"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/sat2-001.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/sat2-001.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/sat2-001.jpg?resize=525%2C300&ssl=1 1.5x"},"classes":[]},{"id":82483,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82483","url_meta":{"origin":82481,"position":5},"title":"Ingeniero de la FIUNA expone estudio sobre terminales de recarga para buses el\u00e9ctricos en CHILECON 2025","author":"Admin","date":"10\/11\/2025","format":false,"excerpt":"El Ing. Marcos Ben\u00edtez, egresado de la carrera de Ingenier\u00eda Electromec\u00e1nica y estudiante de la Maestr\u00eda en Ingenier\u00eda El\u00e9ctrica, con \u00e9nfasis en Sistemas de Potencia y Distribuci\u00f3n de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA), present\u00f3 el trabajo titulado \u201cAlternatives and Requirements for Electric Bus Charging\u2026","rel":"","context":"En \u00abConferencia\u00bb","block_context":{"text":"Conferencia","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=90"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=700%2C400&ssl=1 2x"},"classes":[]}],"jetpack_featured_media_url":"https:\/\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/chilecon2025_recortado_redondo.jpg","_links":{"self":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82481","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=82481"}],"version-history":[{"count":3,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82481\/revisions"}],"predecessor-version":[{"id":82523,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82481\/revisions\/82523"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/media\/82516"}],"wp:attachment":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=82481"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=82481"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=82481"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}