{"id":82518,"date":"2025-11-11T11:46:30","date_gmt":"2025-11-11T14:46:30","guid":{"rendered":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82518"},"modified":"2025-11-11T12:01:08","modified_gmt":"2025-11-11T15:01:08","slug":"doctorando-de-la-fiuna-participo-en-el-ieee-chilecon-2025","status":"publish","type":"post","link":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82518","title":{"rendered":"Doctorando de la FIUNA particip\u00f3 en el IEEE CHILECON 2025"},"content":{"rendered":"<p>El <strong>MSc. Ing. Oscar Paredes Bustto<\/strong>, estudiante del <strong>Programa Doctoral en Electr\u00f3nica de Potencia<\/strong> de la <strong>Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA)<\/strong> y adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 en el IEEE Chilecon 2025, realizado en Valpara\u00edso, Chile, uno de los eventos m\u00e1s relevantes de la regi\u00f3n en ingenier\u00eda el\u00e9ctrica, electr\u00f3nica y computaci\u00f3n.<!--more--><\/p>\n<p>Durante el congreso present\u00f3 dos trabajos cient\u00edficos: uno desarrollado como parte de su investigaci\u00f3n doctoral y otro en representaci\u00f3n de investigadores internacionales, contribuyendo al intercambio de conocimientos y a la difusi\u00f3n de avances en conversi\u00f3n de potencia.<\/p>\n<p>Su participaci\u00f3n cont\u00f3 con el respaldo de CONACYT (Paraguay), la Facultad de Ingenier\u00eda \u2013 Universidad Nacional de Asunci\u00f3n, ANID (Chile), la University of Nottingham (Reino Unido) y<br \/>\nCAPES (Brasil), reforzando la proyecci\u00f3n internacional de la FIUNA en el \u00e1mbito de la investigaci\u00f3n en electr\u00f3nica de potencia. La presencia del MSc. Paredes en IEEE Chilecon 2025 fortalece la producci\u00f3n cient\u00edfica de la instituci\u00f3n y consolida v\u00ednculos de cooperaci\u00f3n con destacados centros acad\u00e9micos de la regi\u00f3n y del mundo.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>El MSc. Ing. Oscar Paredes Bustto, estudiante del Programa Doctoral en Electr\u00f3nica de Potencia de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) y adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 en el IEEE Chilecon 2025, realizado en Valpara\u00edso, Chile, uno de los eventos m\u00e1s relevantes de la regi\u00f3n en ingenier\u00eda el\u00e9ctrica, electr\u00f3nica y computaci\u00f3n.<\/p>\n","protected":false},"author":1,"featured_media":82519,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"advanced_seo_description":"","jetpack_seo_html_title":"","jetpack_seo_noindex":false,"jetpack_seo_schema_type":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"page_builder":"","_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2},"jetpack_post_was_ever_published":false},"categories":[90,824,887,226,75,91,349],"tags":[932,384,902,172],"class_list":["post-82518","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-conferencia-magistral","category-departamento-de-ingenieria-electronica-y-mecatronica","category-eventos","category-investigaciones","category-noticias","category-postgrado","category-publicacion-de-investigacion","tag-chilecon","tag-conacyt","tag-doctorado-en-ingenieria-electronica-con-enfasis-en-electronica-de-potencia","tag-ieee"],"jetpack_publicize_connections":[],"jetpack_shortlink":"https:\/\/wp.me\/pc8Odv-lsW","jetpack_likes_enabled":true,"jetpack_sharing_enabled":true,"jetpack-related-posts":[{"id":82481,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82481","url_meta":{"origin":82518,"position":0},"title":"Docente investigador de la FIUNA present\u00f3 trabajos en la conferencia internacional IEEE CHILECON 2025","author":"Admin","date":"11\/11\/2025","format":false,"excerpt":"El docente investigador MSc. Ing. Marcos Alberto G\u00f3mez Redondo, de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA), adscripto al Departamento de Ingenier\u00eda Electr\u00f3nica y Mecatr\u00f3nica (DIEM), particip\u00f3 activamente en la conferencia internacional IEEE Chilecon 2025, celebrada en Valpara\u00edso, Chile. Este evento se posiciona como uno de\u2026","rel":"","context":"En \u00abConferencia\u00bb","block_context":{"text":"Conferencia","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=90"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/chilecon2025_recortado_redondo.jpg?resize=350%2C200&ssl=1","width":350,"height":200},"classes":[]},{"id":15691,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=15691","url_meta":{"origin":82518,"position":1},"title":"Destacada participaci\u00f3n de la FIUNA en Congreso Internacional de Ingenier\u00eda","author":"Admin","date":"04\/11\/2015","format":false,"excerpt":"\u00a0Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA)\u00a0tuvo una destacada participaci\u00f3n en el\u00a0Congreso Internacional de IEEE CHILECON 2015, con la exposici\u00f3n del Ing. Msc. Mario Arzamendia, quien present\u00f3 \u00a0de un trabajo realizado por investigadores del\u00a0Laboratorio de Sistemas Distribuidos (LSD). Tambi\u00e9n particip\u00f3 del evento Jefe del Departamento de Electricidad\u2026","rel":"","context":"En \u00abCongreso\u00bb","block_context":{"text":"Congreso","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=92"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2015\/11\/Confreso-IEEEChile.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2015\/11\/Confreso-IEEEChile.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2015\/11\/Confreso-IEEEChile.jpg?resize=525%2C300&ssl=1 1.5x"},"classes":[]},{"id":82222,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82222","url_meta":{"origin":82518,"position":2},"title":"La FIUNA participa en CHILECON 2025 con 25 art\u00edculos de investigaci\u00f3n","author":"Admin","date":"30\/10\/2025","format":false,"excerpt":"La Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) participa en el CHILECON 2025, una de las conferencias m\u00e1s importantes de la IEEE Chilean Chapter on Electronics, Electrical and Computer Engineering, que se celebra del 28 al 30 de octubre de 2025 en Valpara\u00edso, Chile, bajo la organizaci\u00f3n\u2026","rel":"","context":"En \u00abEventos\u00bb","block_context":{"text":"Eventos","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=887"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/10\/chilecon2025.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/10\/chilecon2025.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/10\/chilecon2025.jpg?resize=525%2C300&ssl=1 1.5x"},"classes":[]},{"id":59397,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=59397","url_meta":{"origin":82518,"position":3},"title":"Investigadores y estudiantes de la FIUNA presentaron trabajos en el Conferencia IEEE CHILECON 2023","author":"Admin","date":"13\/12\/2023","format":false,"excerpt":"Investigadores y estudiantes de la carrera Ingenier\u00eda Mecatr\u00f3nica de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA) presentaron sus trabajos de investigaci\u00f3n en la Conferencia IEEE CHILECON 2023, realizado del 5 al 7 de diciembre del 2023 en la ciudad de Valdivia, Regi\u00f3n de los R\u00edos, Chile.\u00a0\u2026","rel":"","context":"En \u00abCongreso\u00bb","block_context":{"text":"Congreso","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=92"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2023\/12\/chilecon-grupal.jpg?resize=700%2C400&ssl=1 2x"},"classes":[]},{"id":15727,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=15727","url_meta":{"origin":82518,"position":4},"title":"Trabajo de investigadores de la FIUNA fue presentado en Congreso IEEE CHILECON 2015","author":"Admin","date":"05\/11\/2015","format":false,"excerpt":"\u201cDesign and Implementation of a Gateway between IEC 61850 and IEC 60870-5-101 standards for Power Electrical Systems\u201d, se titula el trabajo de investigaci\u00f3n realizado por Juan Lobo, Miguel Cuenca, Derlis Gregor, Mario Arzamendia, Ra\u00fal Gregor y Sergio Toledo, que fue presentado en el Congreso Internacional de Ingenier\u00eda \u201cIEEE CHILECON 2015\u201d,\u00a0\u2026","rel":"","context":"En \u00abInvestigaci\u00f3n FIUNA\u00bb","block_context":{"text":"Investigaci\u00f3n FIUNA","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=226"},"img":{"alt_text":"IEEEchile","src":"https:\/\/i0.wp.com\/www.ing.una.py\/wp-content\/uploads\/2015\/11\/IEEEchile-464x600.png?resize=350%2C200","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/wp-content\/uploads\/2015\/11\/IEEEchile-464x600.png?resize=350%2C200 1x, https:\/\/i0.wp.com\/www.ing.una.py\/wp-content\/uploads\/2015\/11\/IEEEchile-464x600.png?resize=525%2C300 1.5x"},"classes":[]},{"id":82483,"url":"https:\/\/www.ing.una.py\/FIUNA3\/?p=82483","url_meta":{"origin":82518,"position":5},"title":"Ingeniero de la FIUNA expone estudio sobre terminales de recarga para buses el\u00e9ctricos en CHILECON 2025","author":"Admin","date":"10\/11\/2025","format":false,"excerpt":"El Ing. Marcos Ben\u00edtez, egresado de la carrera de Ingenier\u00eda Electromec\u00e1nica y estudiante de la Maestr\u00eda en Ingenier\u00eda El\u00e9ctrica, con \u00e9nfasis en Sistemas de Potencia y Distribuci\u00f3n de la Facultad de Ingenier\u00eda de la Universidad Nacional de Asunci\u00f3n (FIUNA), present\u00f3 el trabajo titulado \u201cAlternatives and Requirements for Electric Bus Charging\u2026","rel":"","context":"En \u00abConferencia\u00bb","block_context":{"text":"Conferencia","link":"https:\/\/www.ing.una.py\/FIUNA3\/?cat=90"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Foto-para-portada-001-scaled-e1762781947463.jpg?resize=700%2C400&ssl=1 2x"},"classes":[]}],"jetpack_featured_media_url":"https:\/\/www.ing.una.py\/FIUNA3\/wp-content\/uploads\/2025\/11\/Oscar-Paredes.jpg","_links":{"self":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82518","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=82518"}],"version-history":[{"count":2,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82518\/revisions"}],"predecessor-version":[{"id":82522,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/posts\/82518\/revisions\/82522"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=\/wp\/v2\/media\/82519"}],"wp:attachment":[{"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=82518"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=82518"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ing.una.py\/FIUNA3\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=82518"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}